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RESIDUAL LAYER REMOVAL METHOD, RESIDUAL LAYER REMOVAL DEVICE, AND DISPLAY MODULE

机译:残留层去除方法,残留层去除装置和显示模块

摘要

A residual layer removal method of removing a residual layer of an adhesive resin attached to a substrate used in a display module, the residual layer removal method includes: an arranging step of arranging a metal porous material on a surface of the residual layer; a heating step of heating and softening the residual layer; a pressing step of pressing the metal porous material arranged on the surface of the residual layer by the arranging step to the residual layer softened. by the heating step to press-fit at least parts of the residual layer into open holes of the metal porous material; and a peeling step of peeling off the metal porous material in which the residual layer is press-fitted into the open holes from the substrate.
机译:除去附着于显示模块中使用的基板的粘合剂树脂的残留层的残留层去除方法,残留层去除方法包括:在残留层的表面上布置金属多孔材料的布置步骤;加热和软化残余层的加热步骤;按下将布置在残余层的表面上的金属多孔材料压制到残留层的压制步骤。通过加热步骤将至少部分的残余层压入金属多孔材料的开口孔中;剥离金属多孔材料的剥离步骤,其中残留层从基板压入开口孔中。

著录项

  • 公开/公告号US2021129515A1

    专利类型

  • 公开/公告日2021-05-06

    原文格式PDF

  • 申请/专利权人 SHARP KABUSHIKI KAISHA;

    申请/专利号US201816616816

  • 发明设计人 TAKAAKI HIRANO;

    申请日2018-05-24

  • 分类号B32B37/12;G02F1/1339;

  • 国家 US

  • 入库时间 2022-08-24 18:35:24

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