首页> 外国专利> A polymer composition having an amide bond for a molded product that comes into contact with high-pressure hydrogen and a molded product using the same.

A polymer composition having an amide bond for a molded product that comes into contact with high-pressure hydrogen and a molded product using the same.

机译:具有酰胺键的聚合物组合物,其用于模塑产品,该模塑产品与高压氢和使用该模塑产品接触。

摘要

PROBLEM TO BE SOLVED: To provide a polymer composition having an amide bond, which is excellent in heat cycle resistance and can obtain a molded product in which the occurrence of defect points is suppressed even if high-pressure hydrogen is repeatedly filled and released. An amide for a molded product in contact with high-pressure hydrogen, which has a top yield point elongation of 9% or more in an environment of 23 ° C. and a strong elongation product of 110 or more in an environment of 23 ° C. A polymer composition having a bond. [Selection diagram] None
机译:要解决的问题:提供具有酰胺键的聚合物组合物,其具有优异的热循环阻力,并且可以获得即使在重复填充和释放高压氢气,也可以获得缺陷点的发生的模制产品。用于与高压氢接触的模塑产品的酰胺,其在23℃的环境中具有9%或更高的顶部屈服点伸长率为110或更大的延长次数为23°C的环境。具有键的聚合物组合物。 [选择图]无

著录项

  • 公开/公告号JP2021066794A

    专利类型

  • 公开/公告日2021-04-30

    原文格式PDF

  • 申请/专利权人 東レ株式会社;

    申请/专利号JP20190192467

  • 申请日2019-10-23

  • 分类号C08L77/06;F17C1/16;

  • 国家 JP

  • 入库时间 2022-08-24 18:30:43

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