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Manufacturing Method for Forming Embedded Trace Substrate by Using Direct Printing of Circuits
Manufacturing Method for Forming Embedded Trace Substrate by Using Direct Printing of Circuits
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机译:通过使用电路直接印刷形成嵌入式迹线基材的制造方法
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摘要
The present invention is a method of manufacturing a multilayer printed circuit board having the characteristics of an eco-friendly coreless structure and a built-in trace board structure capable of suppressing the use of chemicals while simplifying the process by applying a direct printing method, and A printed circuit board manufactured by this manufacturing method is provided.
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