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Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
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机译:用酸铜电镀浴将铜电镀成通孔的方法
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摘要
Copper electroplating baths containing primary alcohol alkoxylate block copolymers and ethylene oxide/propylene oxide random copolymers having specific HLB ranges are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
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