METHOD AND APPARATUS FOR THREE-DIMENSIONAL ON-LINE MONITORING OF WARPAGE DEFORMATION AND DEFECT OF ENCAPSULATION MODULE

摘要

Disclosed are a method and apparatus for three-dimensional on-line monitoring of a warpage deformation and defect of an encapsulation module. The apparatus comprises a projection moiré module, an X-ray module and a monitoring analysis module. The method comprises: obtaining, by means of the projection moiré module, first warpage information of an encapsulation module sample to be monitored; obtaining, by means of the X-ray module, second warpage information of the encapsulation module sample to be monitored; and obtaining monitoring result information according to the first warpage information and the second warpage information. The problem in the prior art of it not being possible to perform three-dimensional on-line monitoring on a warpage deformation and defect of an encapsulation module is thus solved, and the three-dimensional on-line monitoring can be performed with regard to the failure condition of an encapsulation module for an electronic device in an actual industrial production process.