REACTIVE ADHESIVE FILM WITH GOOD HEAT-AND-HUMIDITY RESISTANCE, IN PARTICULAR FOR BONDING POLYAMIDE

摘要

The present invention relates to: a reactive adhesive film for bonding various materials, such as e.g. materials made of plastic, in particular polyamide and polycarbonate, and metal, in particular aluminium, comprising (a) a polymeric film-forming matrix, (b) at least one epoxide-functionalised (meth)acrylate or vinyl monomer and (c) a reagent selected from an initiator, in particular a free-radical initiator, or an activator; and a reactive adhesive film system comprising two reactive adhesive films each containing (a) a polymeric film-forming matrix, (b) at least one epoxide-functionalised (meth)acrylate or vinyl monomer and (c) a reagent, wherein the reagent of the first reactive adhesive film is an initiator, in particular a free-radical initiator, and the reagent of the second reactive adhesive film is an activator.