A laser processing apparatus (1) includes a movable mirror (13) for changing paths of a processing laser light (11) and a measuring light (15), and a table (17) for changing an incident angle of the measuring light (15). In addition, the laser processing device (1) contains a lens (14) for bundling the processing laser light (11) and the measuring light (15) on a processing point (20), a controller (6) for controlling a laser oscillator (5), the movable mirror ( 13) and the table (17) on the basis of corrected machining data and a measuring processor (4) for measuring the depth of a vapor capillary (22) which is generated at the machining point (20). The corrected machining data is data corrected so as to correct a deviation of an arrival position of the machining laser light (11) and the measurement light (15) caused by chromatic aberration of the lens (14) on the surface of the workpiece (18) becomes. With this configuration, an accurate depth of the vapor capillary (22) can be measured.
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