METHOD OF TESTING MEMORY DEVICE EMPLOYING LIMITED NUMBER OF TEST PINS AND MEMORY DEVICE UTILIZING SAME

摘要

A method is used to test a memory device including a package substrate, a controller die and a memory die. The package substrate includes an isolation pin, a test mode select pin, a test clock pin and a test data pin. The method includes setting the isolation pin to an isolation state to isolate the memory die from the controller die, and when the isolation pin is set to the isolation state, setting the memory die to receive control via the test mode select pin, the test clock pin and the test data pin.