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METAL MATERIAL SOLID-PHASE BONDING METHOD AND SOLID-PHASE BONDING DEVICE

机译:金属材料固相键合方法和固相粘接装置

摘要

To provide a solid phase welding method and a solid phase welding apparatus which are possible to accurately control the welding temperature, to lower the welding temperature and to achieve a solid phase welding of the metallic materials. The present invention provides a solid phase welding method for metallic materials comprising, a first step of forming an interface to be welded by abutting end portions of one material to be welded and the other material to be welded and applying a pressure in a direction substantially perpendicular to the interface to be welded, a second step of raising a temperature of the vicinity of the interface to be welded to a welding temperature by an external heating means, wherein the pressure is set to equal to or more than the yield strength of the one material to be welded and/or the other material to be welded at the welding temperature.
机译:为了提供固相焊接方法和固相焊接装置,可以精确地控制焊接温度,以降低焊接温度并实现金属材料的固相焊接。本发明提供了一种用于金属材料的固相焊接方法,其包括通过抵靠待焊接的一个材料的端部和待焊接的其他材料和在基本垂直的方向上施加压力而形成待焊接界面的第一步骤。待焊接的界面,通过外部加热装置将界面附近的温度提高界面附近的第二步骤,其中压力设定为等于或大于屈服强度待焊接的材料和/或在焊接温度下焊接的其他材料。

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