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Packaged Semiconductor Die with Micro-Cavity and Method for Forming Packaged Semiconductor Die with Micro-Cavity
Packaged Semiconductor Die with Micro-Cavity and Method for Forming Packaged Semiconductor Die with Micro-Cavity
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机译:具有微腔的封装半导体管芯和用于形成具有微腔的封装半导体管芯的方法
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摘要
A packaged electronic die having a micro-cavity and a method for forming a packaged electronic die. The packaged electronic die includes a photoresist frame secured to the electronic die and extending completely around the device. The photoresist frame is further secured to a first major surface of a substrate so as to form an enclosure around the device. Encapsulant material extends over the electronic die and around the sides of the electronic die. The encapsulant material is in contact with the first major surface of the substrate around the entire periphery of the electronic die so as to form a seal around the electronic die.
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