Long-range capacitive gap measurement in wafer form sensor systems

摘要

Embodiments disclosed herein include a sensor wafer. In one embodiment, the sensor wafer comprises a substrate, the substrate comprising a first surface and a second surface opposite the first surface. In one embodiment, the sensor wafer further comprises a first conductive pad having a first surface area, the first conductive pad having a surface substantially coplanar with the first surface of the substrate. In one embodiment, the sensor wafer further comprises a second conductive pad having a second surface area that is less than the first surface area, the second conductive pad having a surface that is substantially coplanar with the first surface of the substrate.