首页> 外国专利> Tessellation hardware subdivision of patches into sub-patches

Tessellation hardware subdivision of patches into sub-patches

机译:镶嵌硬件将修补程序分组为子补丁

摘要

Hardware tessellation units include a sub-division logic block that comprises hardware logic arranged to perform a sub-division of a patch into two (or more) sub-patches. The hardware tessellation units also include a decision logic block that is configured to determine whether a patch is to be sub-divided or not and one or more hardware elements that control the order in which tessellation occurs. In various examples, this hardware element is a patch stack that operates a first-in-last-out scheme and in other examples, there are one or more selection logic blocks that are configured to receive patch data for more than one patch or sub-patch and output the patch data for a selected one of the received patches or sub-patches.
机译:硬件曲面细分单元包括子划分逻辑块,其包括布置成执行修补程序的子划​​分为两个(或更多)子补丁的硬件逻辑。硬件曲面细分单元还包括决策逻辑块,该判决逻辑块被配置为确定贴片是否是子分割的,还是一个或多个硬件元素,控制曲折化曲面的顺序。在各种示例中,该硬件元素是操作第一上一端方案的补丁栈,并且在其他示例中,存在一个或多个选择逻辑块,其被配置为接收多个修补程序或子的补丁数据。补丁并输出所选修补程序或子补丁中的选定之一的补丁数据。

著录项

  • 公开/公告号US10977860B2

    专利类型

  • 公开/公告日2021-04-13

    原文格式PDF

  • 申请/专利权人 IMAGINATION TECHNOLOGIES LIMITED;

    申请/专利号US201916376655

  • 发明设计人 PETER MALCOLM LACEY;SIMON FENNEY;

    申请日2019-04-05

  • 分类号G06T17/20;G06T1/20;G06T15;G06T17/10;

  • 国家 US

  • 入库时间 2024-06-14 21:24:51

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号