CURING INVESTIGATING ARRANGEMENT AND METHOD FOR CONTROLLING THE CURING OF EPOXY RESIN IN THE PRODUCTION OF A HIGH-VOLTAGE LEAD-THROUGH DEVICE

摘要

An curing investigating arrangement (10) comprises a conductor (12), insulation (21) surrounding the conductor (12), the insulation (21) comprising epoxy resin, where the insulation (21) and conductor (12) are provided for forming a high-voltage lead-through device, a curing vessel (22) having an enclosure through which the conductor (12) stretches and in which the insulation (21) is placed, and a group of sensors comprising at least one passive wireless sensor (14, 16, 18, 20) in the insulation (20) in contact with the epoxy resin. The at least one passive wireless sensor (14, 16, 18, 20) is configured to measure a property of the epoxy resin during production of the high-voltage lead-through device and provide it to the first active communication unit (24) using wireless short-range communication wherein the curing investigating arrangement (10) further comprises a number of conductive foils (F1, F2, F3, F4) placed in the insulation (21) surrounding the conductor (12), wherein at least one sensor (14, 16, 18) in the group is placed in a region of the insulation that is electrically stress-free during operation of the lead-through device (34). There is also a method for controlling the curing of epoxy resin.