RF HEAT DISSIPATION PLASTIC, METHOD FOR MANUFACTURING RF HEAT DISSIPATION PLASTIC, AND REPEATER CABINET USING SAME

摘要

An RF heat dissipation plastic is provided. An RF heat dissipation plastic according to one embodiment of the present invention comprises: a polymer matrix comprising a polymer resin; and a first filler that is dispersed in the polymer matrix, and that comprises a high-strength filler, which is a polymer containing at least one hydroxyl group in the repeating unit thereof, and an inorganic coating layer formed on at least a part of the surface of the high-strength filler. Therefore, since the RF heat dissipation plastic comprises the first filler, a low dielectric constant and excellent mechanical strength are simultaneously exhibited. In addition, even though the present invention is designed so as to have a low dielectric constant and excellent mechanical strength, excellent heat dissipation performance is exhibited because of the inclusion of a second filler for improving heat dissipation characteristics. Additionally, since the first filler and the second filler have excellent dispersibility, uniform low-dielectric characteristics, mechanical strength and heat dissipation characteristics are exhibited over the entire area thereof. The RF heat dissipation plastic according to the present invention, which uniformly exhibits a low dielectric constant and excellent mechanical strength and heat dissipation performance over the entire area thereof, can minimize performance deterioration or loss of function of a repeater cabinet capable of being affected by the transmission/reception of a high-frequency band signal according to a dielectric constant, and thus the present invention can be widely applied to various products throughout the industry.