CUTTING BLADE, METHOD OF PRODUCING CUTTING BLADE AND METHOD OF CUTTING WAFER

摘要

(Task) There is a need for a cutting blade capable of cutting this insulating film while suppressing the peeling of the insulating film that is easy to peel when cutting a low-k film or the like. There is provided a cutting blade capable of cutting the insulating film while suppressing the peeling of the insulating film that is easily peeled off during cutting. (Solution means) A cutting blade having a binder and abrasive grains, wherein the abrasive grains are fixed by a binder of at least a part of glass-like carbon is provided. Preferably, the average particle diameter of the abrasive grains of the cutting blade is 12 μm or less.