Cutting blades, cutting blade manufacturing methods, and wafer cutting methods

摘要

PROBLEM TO BE SOLVED: To cut a cutting blade capable of cutting an insulating film while suppressing peeling of an insulating film which is easily peeled off at the time of cutting a Low-k film or the like. Provided is a cutting blade capable of cutting this insulating film while suppressing peeling of the insulating film that is easily peeled off during cutting. A cutting blade having a binder and abrasive grains, wherein the abrasive grains are fixed by a binder having at least a part of glassy carbon. Preferably, the average particle size of the abrasive grains of the cutting blade is 12 μm or less. [Selection diagram] Fig. 1