Camera module attaching system with improved alignment reliability and an attaching method using the system

摘要

The present invention relates to a system for manufacturing a camera module by attaching an FPCB substrate, in which a module transfer unit transferring a first tray accommodating a plurality of modules in a predetermined direction, and an FPCB into which a second tray accommodating a plurality of FPCB substrates is inserted. An FPCB transfer unit for transferring the second tray at a position not intersecting with the module transfer unit, the first tray including an input unit and an FPCB discharge unit through which the empty second tray is discharged after the input of the FPCB into the system is completed. ACF attaching part for attaching the ACF film to the upper surface of the module accommodated in the module, FPCB attaching part for attaching the FPCB to the upper side of the ACF film bonded to the module by picking up the FPCB of the second tray, ACF film interposed between the module and the FPCB A thermosetting unit for curing by applying heat to and a control unit for controlling the plurality of components, wherein the ACF attaching unit is disposed above an arbitrary point where the module transfer unit is disposed, and is accommodated in the first tray. A camera module attaching system with improved alignment reliability, characterized in that the ACF film is attached to the device, and the FPCB input unit and the FPCB discharge unit are arranged in front of the system, so that the second tray can be easily inserted and discharged, and a camera module using the same. This is the attaching method.