HIGH-POWER ELECTRONIC DEVICES CONTAINING METAL NANOPARTICLE-BASED THERMAL INTERFACE MATERIALS AND RELATED METHODS

摘要

High power electronic components generate a significant amount of heat, which must be removed in the course of normal operation of the device. Certain types of electronic components, such as MMICs and LEDs, may contain materials that are difficult to adhere effectively to the heat sink to form a thermal interface between the heat sink and the heat sink. The device assembly may include a heating electronic component in thermal communication with the metal heat sink through the metal thermal interface layer. The metal thermal interface layer is disposed between the heating electronic component and the metal heat sink. The metal thermal interface layer is formed of a composition comprising a plurality of metal nanoparticles that are at least partially fused together. A method for forming a thermal interface layer includes heating the metal nanoparticles above a fusion temperature of the metal nanoparticles, and then cooling the liquefied metal nanoparticles to facilitate bonding of the electronic component.