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METHOD FOR PRODUCING AN ATOM TRAP, AND ATOM TRAP

机译:制造原子陷阱的方法和原子陷阱

摘要

The invention relates to a method for producing an atom trap (20), having the steps of: (a) applying an electrically conductive starting layer (2) onto a substrate (1), (b) applying at least one electric conductor element (4) onto the starting layer (2) by means of an electrochemical deposition process and/or a lift-off method, (c) applying at least one contacting element (6) by means of an electrochemical deposition process and/or a lift-off method such that the at least one contacting element (6) is connected to the at least one electric conductor element (4) in an electrically conductive manner, (d) removing the starting layer (2) in regions in which the electric conductor element (4) was not applied, (e) applying an insulation layer (7) which at least partly covers the at least one electric conductor element (4) and the at least one contacting element (6), (f) planarizing the insulation layer (7) and exposing the at least one contacting element (6), and (g) applying at least one additional electric conductor element (14) by means of an electrochemical deposition process and/or a lift-off method such that the at least one additional electric conductor element (14) is connected to the at least one contacting element (6) in an electrically conductive manner.
机译:本发明涉及一种用于制造原子阱(20)的方法,其步骤:(a)将导电起动层(2)施加到施加至少一个电导体元件的基板(1),(b)上( 4)通过电化学沉积工艺和/或升降方法,(c)通过电化学沉积工艺和/或升力施加至少一个接触元件(图6)的剥离方法(C)关闭方法,使得至少一个接触元件(6)以导电方式连接到所述至少一个电导体元件(4),(d)在电导体元件的区域中移除起始层(2)不施加(4),(e)施加至少部分地覆盖至少一个电导体元件(4)和至少一个接触元件(6),(f)平坦化绝缘层的绝缘层(7) (7)并暴露至少一个接触元件(6),并施加至少一个广告借助于电化学沉积工艺和/或剥离方法,使得至少一个附加的电导体元件(14)在电气中连接到所述至少一个接触元件(6)。导电方式。

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