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High-precision and quick chip pickup / mounting device and chip mounting machine using it

机译:高精度和快速芯片拾取/安装装置和芯片安装机使用它

摘要

PROBLEM TO BE SOLVED: To provide a highly accurate and rapid chip pickup / mounting device. A pickup / mounting device includes a wafer stage for mounting a wafer 1 and a chip support 6 for mounting a chip mounting substrate 7, and the wafer stage and the chip support 6 are provided with each other. A rotary drive device is provided at the central position, and a rotary tower is connected to the rotary drive device to drive the rotary tower so as to realize rotation of 360 ° in the horizontal direction. In the direction, at least three suction nozzles for taking out and placing the chip 3 on the wafer 1 are arranged at equal intervals, and a vertical motion driving device for driving the suction nozzles so as to move up and down in the vertical direction is provided. Has been done. The structure of the pickup / mounting device is rational, the response of the entire device is fast, and the chip mounting efficiency and the chip mounting yield are greatly improved. [Selection diagram] Fig. 1
机译:要解决的问题:提供高度准确,快速的芯片拾取/安装装置。拾取/安装装置包括用于安装晶片1的晶片级和用于安装芯片安装基板7的芯片支撑件6,晶片级和芯片支撑件6彼此设置。旋转驱动装置设置在中心位置,旋转塔连接到旋转驱动装置以驱动旋转塔,以便在水平方向上实现360°的旋转。在方向上,用于取出和将芯片3放置在晶片1上的至少三个吸入喷嘴以相等的间隔布置,以及用于驱动抽吸喷嘴的垂直运动驱动装置,以便在垂直方向上上下移动假如。已经完成。拾取/安装装置的结构是合理的,整个装置的响应快,并且芯片安装效率和芯片安装产量大大提高。 [选择图]图1

著录项

  • 公开/公告号JP3231028U

    专利类型

  • 公开/公告日2021-03-11

    原文格式PDF

  • 申请/专利号JP20190600083U

  • 发明设计人 王 敕;

    申请日2018-08-27

  • 分类号H01L21/677;H05K13/04;

  • 国家 JP

  • 入库时间 2024-06-14 21:21:58

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