Modeling the Component Pickup and Placement Sequencing Problem with Nozzle Assignment in a Chip Mounting Machine

摘要

In the production of electronic circuit boards in industry, electronic components are placed onto the circuit board by component placement machines. The actions of multifunction placement machines are roughly divided into pick-up phase and placing phase. In the past, these two phases were typically optimized independently of each other to be combined, which do not necessarily lead to the overall optimization. Therefore, in this paper, the action of multifunction component placement machines is modeled in a different way than that in the conventional approach, and a method for comprehensive optimization of pick-up phase and placing phase is proposed. The proposed method, which takes into account nozzle allocation, can also be applied to the load balancing of component placement machine production lines.