Provided is a plating method for improving in-plane uniformity of various square-shaped substrates without changing an inter-electrode distance. A plating method according to an aspect in which an anode holder (44) adapted to hold a square-shaped anode (62) and a substrate holder (24) adapted to hold a square-shaped substrate (W) are disposed to face each other and plating processing is performed on the substrate (W), the anode holder (44) includes a holder main body (80) having a square-shaped opening and adapted to hold the anode (62) with a surface of the anode (62) exposed from the opening, and a mask (88) adapted to cover a part of the anode (62) inside the opening, and a position covered with the mask (88) is changed in accordance with the substrate (W).
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