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Multi-parametric sensor with bridge structure

机译:具有桥梁结构的多参数传感器

摘要

The disclosure relates to a sensor for detecting and/or analysing a gas. The sensor comprises a substrate, a recess or opening arranged in the substrate, a first bridge structure and a second bridge structure. The first bridge structure and the second bridge structure extend over said recess or opening and are anchored in the substrate. The first bridge structure forms a first hotplate and comprises a first patch of sensing material, in particular of a metal oxide material, arranged on the first hotplate, electrodes adapted to measure an electrical property of the first patch and a heater adapted to heat the first hotplate. The second bridge structure comprises a temperature sensor. The sensor comprises circuitry for driving the heater and for processing signals from the electrodes and the temperature sensor. The sensor provides a first operation mode configured to perform a measurement of an electrical property of the first patch and a second operation mode configured to operate the second bridge structure in a sensing mode to perform a measurement of a thermal property of the gas. The thermal property is a thermal capacity and/or a thermal conductivity and/or a thermal diffusivity of the gas.
机译:本公开涉及用于检测和/或分析气体的传感器。传感器包括基板,布置在基板中的凹槽或开口,第一桥结构和第二桥结构。第一桥结构和第二桥结构在所述凹槽或开口上延伸并锚固在基板中。第一桥结构形成第一热板,并且包括第一贴片的感测材料,特别是金属氧化物材料,所述金属氧化物材料,所述金属氧化物材料,所述金属氧化物材料布置在第一加热板上,电极适于测量第一贴片的电特性和适于加热的加热器加热板。第二桥结构包括温度传感器。传感器包括用于驱动加热器的电路和用于处理来自电极的信号和温度传感器。传感器提供了第一操作模式,该第一操作模式被配置为执行第一贴片的电特性的测量和第二操作模式,第二操作模式被配置为在感测模式下操作第二桥接结构以进行气体的热特性的测量。热特性是热容量和/或导热率和/或气体的热扩散率。

著录项

  • 公开/公告号US10942141B2

    专利类型

  • 公开/公告日2021-03-09

    原文格式PDF

  • 申请/专利权人 SENSIRION AG;

    申请/专利号US201716346205

  • 发明设计人 MATTHIAS MERZ;MARK HORNUNG;FELIX HOEHNE;

    申请日2017-10-30

  • 分类号G01N27/18;G01N27/12;H05B3/22;

  • 国家 US

  • 入库时间 2022-08-24 17:34:29

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