Provides a phenolic hydroxyl group-containing compound excellent in heat resistance, a resist composition excellent in thermal decomposition resistance, photosensitivity and resolution, and a composition for a resist underlayer film excellent in thermal decomposition resistance and dry etching resistance. The following structural formula (1) (In the formula, R 1 is a hydrogen atom, an alkyl group, or an aryl group, and n is an integer of 2 to 10. R 2 is any one of an alkyl group, an alkoxy group, an aryl group, an aralkyl group, and a halogen atom, and m is 0 to It is an integer of 4. When m is 2 or more, a plurality of R 2 may each be the same or different, and may be bonded to either of the two aromatic rings of the naphthylene skeleton. Phenolic hydroxyl group-containing compounds.
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