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EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, CURABLE RESIN COMPOSITION CONTAINING EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, AND CURED PRODUCT OF SAME
EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, CURABLE RESIN COMPOSITION CONTAINING EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, AND CURED PRODUCT OF SAME
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机译:含环氧基的聚有机硅氧烷,含有环氧基的聚有机硅氧烷的可固化树脂组合物,并固化产物
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摘要
The present invention provides: an epoxy group-containing polyorganosiloxane which exhibits high compatibility with an initiator or other resins, while having low viscosity, high curing rate, excellent adhesiveness and excellent impact resistance; a curable resin composition; and a cured product. An epoxy group-containing polyorganosiloxane which comprises M unit (R1R2R3SiO1/2), D unit (R4R5O2/2) and Q unit (SiO4/2), wherein the content of T unit (R6SiO3/2) relative to all silicon atoms is 80 mol% or less. The epoxy group contains a group represented by formula (2) and a group represented by formula (3). In formula (2), R8 represents an optionally substituted divalent organic group having from 1 to 20 carbon atoms; and g represents 0 or 1. In formula (3), R9 represents an optionally substituted divalent organic group having from 1 to 20 carbon atoms; and h represents 0 or 1, 0 ≤ i ≤ 8 and 0 ≤ j ≤ 8.
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机译:本发明提供了一种含环氧基的聚有机硅氧烷,其与引发剂或其他树脂具有高相容性,同时具有低粘度,高固化速率,优异的粘合性和优异的抗冲击性;可固化树脂组合物;和治愈的产品。含环氧基的聚有机硅氧烷,其包含M单位(R 1 SOP> R 2℃ sup> R 3 sup> SiO 1/2 sub>) ,D单位(R 4 sup> R 5 sup> O 2/2 sub>)和q单元(SiO 4/2 sub>) ,其中相对于所有硅原子的T单元的含量(R 6 sup> siO 3/2 sub>)为80摩尔%或更小。环氧基团含有由式(2)表示的基团和由式(3)表示的基团。在式(2)中,R 8 SOP>表示具有1至20个碳原子的任选取代的二价有机基团;在式(3)中表示0或1.在式(3)中,R 9 SOP>表示具有1-20个碳原子的任选取代的二价有机基团;并且h表示0或1,0≤i≤8和0≤j≤8。
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