Manufacturing method of high heat radiation board for multi-chip LED module or multi-chip sensor module and its high heat radiation board

摘要

The present invention relates to a method of manufacturing a high heat dissipation substrate for a multi-chip LED module or a multi-chip composite sensor module, or to a high heat dissipation substrate, the method comprising: Preparing a base metal 10 having a mounting protrusion 11 that is a metal material and capable of mounting an LED or sensor (100), preparing a heat-dissipating plastic injection material mixed with nano metal oxide for the heat-dissipating plastic layer (15) Step (S2), forming a heat-dissipating plastic layer 15 by injecting, filling and applying the heat-dissipating plastic injection material onto the base metal 10 to make the top surface of the base metal 10 flat (S3) ), forming a pattern for wiring on the base metal 10 filled with the heat dissipation plastic layer 15 by laser irradiation (S4), the base metal 10 on which the pattern is formed and the heat dissipation plastic layer 15 ) To create a boundary on the pattern by applying and applying PSR on the upper surface of the filler (S5), to enable wire bonding with copper (Cu), nickel (Ni) and gold plating depending on the wire material on the formed pattern. It characterized in that it comprises at least a step of plating (S6), performing wire bonding by mounting the LED or sensor on the mounting protrusion (11) (S7).