Polyamide resin composition and molded article

摘要

PROBLEM TO BE SOLVED: To provide a polyamide resin composition having good extrusion productivity, suppressing the generation of mold deposit during molding, and having excellent mold releasability and fluidity. A polyamide resin composition is a polyamide resin composition containing 100 parts by mass of (A) polyamide and 0.5 parts by mass or more and 3 parts by mass or less of (B) bishydroxyester compound. The bishydroxyester compound (B) is at least one bishydroxyester compound selected from the group consisting of the bishydroxyester compound represented by the general formula (I) and the bishydroxyester compound represented by the general formula (II). Is. (In the formula, R11, R12, R21 and R22 are independently chain alkyl groups having 1 or more hydroxyl groups and having 2 to 22 carbon atoms, and n11 and n21 are integers of 2 to 10). None