Electronic equipment and its manufacturing method, and driver IC manufacturing method

摘要

PROBLEM TO BE SOLVED: To take measures against connection failure due to tensile stress of a driver IC in an electronic device having a curved terminal region. SOLUTION: An electronic device in which a driver IC 10 is mounted in a terminal region and the terminal region is curved. The driver IC 10 has a circuit 12 and a plurality of bumps, and the surface of the driver IC 10 on which the plurality of bumps are formed. An electronic device characterized in that an inclined portion 11 is formed on a surface opposite to the above-mentioned surface, and the inclined portion 11 overlaps with the outermost bump among the plurality of bumps. [Selection diagram] FIG. 9