Vapor deposition equipment

摘要

PROBLEM TO BE SOLVED: To improve uniformity in both film thickness and composition distribution by improving a supply method of Group III and dopant materials. SOLUTION: If a material having a steep deposition rate curve is introduced from near the substrate, and conversely, a material having a gentle pattern is introduced from a distance from the substrate, the difference in deposition rate patterns cancels each other out. Then, the materials of the elements having different deposition rate curves are introduced from different gas introduction paths so that the distribution of the film thickness and the composition becomes uniform. In addition, by optimizing the total flow rate for the gases of different component elements and providing an introduction path for the adjusting gas between the gas introduction paths for the component elements, the distribution can be made uniform in terms of both film thickness and composition. be able to. [Selection diagram] Fig. 1