Device for the temperature of one pitch of the electrical differential warmth straight, in particular of heating.

• 1. 用于在无线电范围、尤其是在室内区域的无线电范围中检测/识别具有至少一个运动速度且每个都至少一次重复的重复性运动、尤其是节奏性手势的方法、数字工具、设备和系统 [P] . 中国专利： CN107003397A . 2017-08-01
• 2. 用于对玻璃面尤其是对室外摄像机的保护玻璃进行加热的加热装置以及具有保护玻璃的电子的和/或光学的装置 [P] . 中国专利： CN102099738A . 2011-06-15
• 3. Device for adjusting the temperature of electrical warmth differential straight, in particular of heating. [P] . 德国专利： DE1741270U . 1957-03-14

  机译： 用于调节电热差温度的装置，尤其是加热装置。

• 4. Controller for setting the temperature of electrical warmth differential straight, in particular, electrical heating. [P] . 德国专利： DE1653884U . 1953-04-16

  机译： 控制器，用于将电暖温差的温度设置为直线，特别是电加热。

• 5. Arrangement for the continuous temperature regulation in the case of electrical differential warmth straight, especially heating. [P] . 德国专利： DE1657532U . 1953-06-18

  机译： 在电气差温直的情况下，尤其是在加热的情况下，进行连续温度调节的安排。

• 1. A Study on Relationship among Blade Camber Direction and Pitch Angle and Performance of a Small Straight-Blade Darrieus Wind Turbine by Using Scale Test Model and Gurney Flap [J] . Tadakazu Tanino, Keisuke Hara, Ryo Yoshihara, 流量控制、测量及可视化（英文） . 2021,第002期
• 2. Fine-pitch chip-on-flex packaging of optoelectronic devices using low temperature optodic bonding [C] . Yixiao Wang, Melanie Gauch, Detlev Ristau, Pan Pacific Microelectronics Symposium . 2016
• 3. A Low-Temperature Printing Technology for Fabricating Electrically Conductive Structures and Devices Using Plasma-Activated Stabilizer-Free Inks [D] . ?Sui, Yongkun 2019
• 4. Room-temperature electrically pumped near-infrared random lasing from high-quality m-plane ZnO-based metal-insulator-semiconductor devices [O] . Chao Chen, Ti Wang, Hao Wu, 2015
• 5. A low-temperature device architecture for the statistical study of electrical characteristics of 256 quantum devices [O] . Al-Taie, H., Smith, L. W., Xu, B., 2014
• 6. High Temperature Thermal Conductivity Measurements of UO sub 2 by Direct Electrical Heating. Final Report [R] . Bassett, B. 1980

• 1. Diode Laser Soldering Technology of Fine Pitch QFP Devices [J] . XUE Songbai ,ZHANG Liang ,HAN Zongjie . 中国机械工程学报 . 2011,第005期
• 2. MECHANICAL PROPERTIES OF FINE PITCH DEVICES SOLDERED JOINTS BASED ON CREEP MODEL [J] . . 中国机械工程学报 . 2008,第006期
• 3. Study on surfce mount technology for fine pitch L type lead devices [J] . 李明雨 ,冯武锋 ,王春青 . 中国焊接：英文版 . 1998,第001期
• 4. Effect of Heat Extraction by Metal Lines and Two Sided Cooling on Temperatures in Organic Light Emitting Diode Based Devices [J] . Deepak . ,Gokaran Nath Shukla . 电子器件冷却与温度控制期刊（英文） . 2011,第3期
• 5. 用于磷酸浓缩的微波均匀加热装置设计 [C] . LUO Bin ,骆斌 ,DENG You-qi . 电子陶瓷、陶瓷-金属封接第十八届会议暨真空电子与专用金属材料分会2018年年会 . 2018
• 6. 适用于压入方法材料试验机的小型高温加热装置研究 [A] . 姜琦 . 2019