Circuit arrangement for a fork for transformation of a four wire circuit in a two wire circuit or vice versa, in which the fork on all four connection has to be the same impedance

• 1. 一种应用于印刷电路板的四线测试电路 [P] . 中国专利： CN205003215U . 2016.01.27
• 2. 用于布置电路载体的方法和具有根据该方法布置的电路载体的用于机动车的照明装置 [P] . 中国专利： CN107965729B . 2021.08.27
• 3. ARRANGEMENT WITH A FORK CIRCUIT FOR THE TWO-WIRE-FOUR-WIRE TRANSITION IN PCM-TIME MULTIPLEX SYSTEMS. [P] . AT4848T . 1983-10-15

  机译： PCM时间多路复用系统中两线四线过渡的叉形电路布置。

• 4. Circuit arrangement for an electronic two wire - two-wire - fork, in particular for use in a telephone set [P] . 德国专利： DE2629993A1 . 1977-02-03

  机译： 电子两线制两线制叉形电路装置，特别是用于电话机

• 5. Circuit arrangement for remote from the selection of networks with by forks coupled two wire sections - two-wire - [P] . 德国专利： DE1107719B . 1961-05-31

  机译： 用于通过叉连接两个线段-两线制-来选择网络的远程电路装置

• 1. Effect of the Circuit and Wire Parameters on Exploding an Al Wire in Water [J] . 周庆, 张乔根, 张俊, 等离子体科学和技术（英文版） . 2011,第006期
• 2. Inserting new synaptic connections into damaged neural circuits: towards synapse therapy? [J] . Ithai Rabinowitch 中国神经再生研究（英文版） . 2022,第002期
• 3. Quality assurance for wire connections used in integrated circuits via magnetic imaging [C] . Holzl Patrick A., Wiesner Thomas, Zagar Bernhard G. Instrumentation and Measurement Technology Conference (I2MTC), 2012 IEEE International . 2012
• 4. Improving Boolean Circuit Designs with Wire-based Logic Transformations. [D] . Lam, Tak Kei. 2014
• 5. Super‐Soft DNA/Dopamine‐Grafted‐Dextran Hydrogel as Dynamic Wire for Electric Circuits Switched by a Microbial Metabolism Process [O] . Jinpeng Han, Yuchen Cui, Xinpeng Han, 2020
• 6. CIRCUIT AND SCATTERING MATRIX ANALYSIS OF THE WIRE MEASUREMENT METHOD OF BEAM IMPEDANCE IN ACCELERATING STRUCTURES § [O] . R. M. Jones, N. Baboi, N. M. Kroll, 2003

• 1. Compensation of Unbalanced Impedance of Asymmetric Wind Power PMSG Compensated by External Circuits in Series [J] . Yashan Hu ,Z.Q.Zhu ,Milijana Odavic . 中国电工技术学会电机与系统学报(英文) . 2017,第2期
• 2. Analytical and Numerical Model Confrontation for Transfer Impedance Extraction in Three-Dimensional Radio Frequency Circuits [J] . Olivier Valorge ,Fengyuan Sun ,Jean-Etienne Lorival . 电路与系统（英文） . 2012,第2期
• 3. Creating Distinctive Connections between Multifunctional Microwave Circuits and Mobile-Terminal Radio-Frequency Integrated Chips Using Integrated Passive Device Technology [J] . Yongle Wu ,Mengdan Kong ,Zheng Zhuang . 中国通信 . 2021,第008期