Brass, copper-tin, and copper plating bath brightener

• 1. 电镀铜用高填平酸铜光亮剂 [P] . 中国专利： CN107641822B . 2019.08.09
• 2. 电镀铜用高填平酸铜光亮剂 [P] . 中国专利： CN106609385B . 2018.03.30
• 3. COPPER-TIN ALLOY PLATING BATH AND COPPER-TIN ALLOY PLATING METHOD USING THIS PLATING BATH [P] . 日本专利： JP2004010907A . 2004-01-15

  机译： 铜锡合金镀浴和使用该镀浴的铜锡合金镀方法

• 4. COPPER-TIN ALLOY PLATING FILM, NON-CYANIDE COPPER-TIN ALLOY PLATING BATH AND PLATING METHOD USING THEREOF [P] . 韩国专利： KR20120039567A . 2012-04-25

  机译： 铜锡合金镀膜，非氰化物铜锡合金镀浴及其使用方法

• 5. copper-tin alloy plating film, non-cyanide copper-tin alloy plating bath and plating method using thereof [P] . 韩国专利： KR101168215B1 . 2012-07-25

  机译： 铜锡合金镀膜，非氰化物铜锡合金镀浴及其使用方法

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• 3. Determination of brightener concentration in Non-cyanide alkaline Zinc plating bath by Cyclic Voltammetric Stripping method [C] . S.Rajendran, S.Bharathi, V.N.Loganathan, SUR/FIN-1996 international technical conference . 1996
• 4. Mechanism of SPS acceleration in a PEG containing copper plating bath [D] . Kreider, Ashleigh 2012
• 5. Brass Alloys: Copper-Bottomed Solutions against Hospital-Acquired Infections? [O] . Emilie Dauvergne, Catherine Mullié 2021
• 6. The Fabrication of Freestanding Heterogeneous Copper-Tin Films with Meniscus Brush Plating Electrodeposition [O] . Kimberly Y. Scott, Anna Halajko, Glenn G. Amatucci 2016
• 7. High-Performance Liquid Chromatography Methods for Characterization of a Plating Bath Brightener Additive: Final Report [R] . Foster, R. L. 1987

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• 4. 焦磷酸盐镀铜液中正磷酸盐含量的影响我厂是怎样解决锡磷青铜配套镀银脆铜、起泡故障的 [C] . 顾福林 . 2004年全国电子电镀学术研讨会 . 2004
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