Procedure and device for the protection of metallic surfaces against their placement in chemical metalization baths. (Machine-translation by Google Translate, not legally binding)

摘要

Procedure for the protection of metallic surfaces against their plating in chemical metallization baths, characterized in that it comprises applying to the objects that come into contact with the liquid of the metallization bath, with the use of a potentiostat, a certain anodic protective potential, adjusting this potential at the maximum current density of 10-4 amp/cm2 and a magnitude of the equilibrium potential, approximately between the Hade potential and the transpasivity, and control the protection current by means of a transistor amplifier driven according to the connection scheme of Darlington and connected behind a difference voltage amplifier, depending on the magnitude of the protective potential between counter electrodes and the objects to be protected. (Machine-translation by Google Translate, not legally binding)