in the plating bath 24 carat gold

• 1. 黄金电镀废液中的黄金萃取方法 [P] . 中国专利： CN1243890A . 2000-02-09
• 2. 一种电镀黄金的方法和硬质黄金的制备方法 [P] . 中国专利： CN103938231B . 2015.04.01
• 3. Bath for the electrolytic gold plating to 24 carat [P] . 法国专利： FR1544121A . 1968-10-31

  机译： 电解镀金槽至24克拉

• 4. Three in one mobile 24 carat gold plating system [P] . 英国专利： GB9400966D0 . 1994-03-16

  机译： 三合一移动式24克拉镀金系统

• 5. Method of the electrolytic coating in order to produce bright deposits 24 carat gold, and the cladding bath for the implementation of this process [P] . 法国专利： FR1497810A . 1967-10-13

  机译： 为了产生24克拉金的明亮镀层而进行电解镀层的方法，以及用于执行此过程的熔覆浴

• 1. Electroless Plating Lead and Lead-Tin on Copper Using an Eco-Friendly Plating Bath [J] . A. B. Abdel-Aziz, M. M. B. El-Sabbah, I. M. Ghayad, 材料科学与应用期刊（英文） . 2020,第012期
• 2. Comparison Between Electrolysis and Reduction for Treatment of Spent Electroless Nickel Plating Bath [J] . YAN Lei, LI Shuqin, YU Xiujuan 东北农业大学学报（英文版） . 2009,第002期
• 3. Reclaim nickel and remove organics from the spent electroless nickel-plating bath by electrolysis [J] . YU Xiu-juan, SHEN Jin, MENG Xian-lin, 哈尔滨工业大学学报（英文版） . 2006,第004期
• 4. Removal of nickel from spent electroless nickel-plating bath with nickel foam cathode [J] . 于秀娟, 郑彤, 魏杰, 哈尔滨工业大学学报（英文版） . 2002,第004期
• 5. The Purity of Gold Plating in theMicroelectronic Packages and the Impurities in the Plating Bath [C] . Shen Zhuoshen, Yang Xiaozhan, Wei Xin, International symposium on electronic packaging technology;ISEPT; 19961209-12;19961209-12; Shanghai(CN);Shanghai(CN) . 1996
• 6. Deposition of gold from an organic immersion plating bath for microelectronic applications. [D] . Dahlgren, Eric James. 2003
• 7. A prospective randomized study comparing a cervical carbon fiber cage to the Smith–Robinson technique with allograft and plating: up to 24 months follow-up [O] . Stephen I. Ryu, Michelle Mitchell, Daniel H. Kim 2006
• 8. Synergistic Effect of Organic Additives and Pulse-Current Plating in a Gold Electrodeposition Citric Acid Bath and Gold Plating Film Corrosion Resistance. Relationship between Structures of Additives and Corrosion Resistance of Film. [O] . Makoto YUASA, Tekeo TSUTSUMI, Yasuo MIYADATE, 1995
• 9. Phosphorus-31 NMR analysis of gold plating baths [R] . Smith, R E 1992

• 1. Effects of Concentration of 5,5 - Dimethylhydantoin as Com- plexing Agent and pH Value of Plating Bath on Electrodepo- sition of Silver [J] . . 材料保护 . 2015,第1期
• 2. 采用静压式水平电镀槽的带钢电镀锌生产线 [C] . Weng Qi ,翁祺 . 中国金属协会冶金设备分会第二届第一次冶金设备设计学术交流会 . 2013
• 3. 立式连续电镀槽中镀层均匀性的改善作用研究及多物理场耦合分析 [A] . 金晶 . 2013