The non-stick, in the heat to elastomeric curable molding compositions organopolysiloxane reason position

• 1. 可固化的有机基聚硅氧烷树脂组合物和由其模塑的光学部件 [P] . 中国专利： CN101213257B . 2012.07.04
• 2. 可固化的有机基聚硅氧烷树脂组合物和由其模塑的光学部件 [P] . 中国专利： CN101213257A . 2008-07-02
• 3. In the heat to resin-like curable molding compositions and molded parts to organopolysiloxane reason position [P] . 德国专利： DE1669936B1 . 1971-05-13

  机译： 在加热至树脂状的可固化成型组合物和成型件至有机聚硅氧烷的原因位置

• 4. To flammenbestaendigen elastomeric thermosetting molding compositions organopolysiloxane reason position [P] . 德国专利： DE1669918A1 . 1971-03-11

  机译： 对flambebeendigen弹性体热固性模塑组合物有机聚硅氧烷的原因

• 5. Improving the strength and toughness of elastomers from curable molding compositions organopolysiloxane reason position [P] . 德国专利： DE2011046B2 . 1973-05-17

  机译： 由可固化模塑组合物有机聚硅氧烷提高弹性体的强度和韧性的原因

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