Chipboards from unclassified saw dust.. GG-. By adding, to the saw dust, 10 to 30% of cellulose chips which are retained on sieves with meshes of from 10 to 20 mm. The saw dust has a moisture content of from 2 to 6% and is treated with a bonding agent in an amount of from 7 to 12%. The treated saw dust is used as the central layer in laminated chipboards whose external faces are made from planar chips or veneers. - The treated saw dust is spread onto sieves on which the saw dust cake is heated 145 to 165 degrees C and pressed first at pressure of 15 to 30 kp per sq.cm. for 2 to 6 mins and subsequently at a reduced pressure. - The process uses chips which on account of their size were believed unsuitable for chipboard manufacture.
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