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curing for compositions based on polymeric xxxx xxxx xxxx organosilicon compounds and acid fuel substances

机译:固化基于聚合物xxxx xxxx xxxx有机硅化合物和酸性燃料物质的组合物

摘要

1,227,074. Curable organosilicon resins containing acidic " fillers. DOW CORNING CORP. 25 April, 1969 [27 May, 1968], No. 21176/69. Heading C3T. A curable resin comprises (A) an organosilicon polymer containing at least 0À25 wt. per cent of Si-bonded OH groups and having its Si atoms linked by oxygen atoms or divalent hydrocarbon or halohydrocarbon groups which may contain ether linkages, the remaining Si valences being satisfied by monovalent hydrocarbon or halohydrocarbon, optionally ethercontaining, groups or cyanoalkyl groups, providing at least 0À75 such groups per Si atom, (B), as filler, MoS 2 , ZnS, BN, WS 2 , ZnO, or powdered Ni, Al, Zn, Cu, bronze, or stainless steel, or a mixture thereof, and (C) triethylene diamine or 2-ethyl-4-methyl-imidazole, (C) amounting to 0À1-10 wt. per cent of (A), and (A) to 3-90 wt. per cent of (A) plus (B). Suitable organosilicon polymers are described; preferred are polysiloxanes having methyl, ethyl, isopropyl, vinyl and/or phenyl groups and at least 1 wt. per cent of OH. Other (exemplified) conventional fillers may be used, up to 75% of the total weight of filler, and other conventional curing catalysts, e.g. PbO, PbCO 3 , carboxylic acids and ammonium carboxylates; other resins, e.g. phenolic, epoxy or alkyd resins, or PTFE may also be present. In Examples 1-7 a polysiloxane containing monomethyl- and monophenyl-siloxane units with some phenylmethyl- and diphenyl-siloxane units and 7% OH is milled with MoS 2 and/or ZnS and Ca or Zn stearate and either of the catalysts (C) with or without a diallyl phthalate resin plus dicumyl peroxide, or carnauba wax plus diepoxy dicyclopentadiene plus cyclic succinic-glutaric dianhydride or benzophenone tetracarboxylic dianhydride, or a phenolic resin, or talc. In Example 9, a wide variety of compositions are described using all the specified fillers (B) and catalysts (C), with siloxanes containing methyl, ethyl, isopropyl, octadecyl, phenyl, tolyl, cyanopropyl, methoxypropyl and trifluoropropyl groups and some units -Si(CH 3 )C 6 H 4 OC 6 H 4 Si(CH 3 )O- and -Si(CH 3 ) 2 CH 2 CH 2 CHFCH 2 CH 2 -Si(CH 3 ) 2 -; auxiliary fillers: aerogel SiO 2 , TiO 2 , quartz, diatomaceous earth, Fe 2 O 3 , glass fibres or Fe 2 O 3 ; and organosilicon compounds: 1: 3: 5- tris - (hydroxydimethylsilyl) - benzene, phenylsilanetriol, HOSi (CH 3 ) 2 OSi(CH 3 ) 2 CH 2 CH 2 CH 2 OCH 2 CHFCH 2 Si(CH 3 ) 2 OSi(CH 3 ) 2 OH or 1-trifluoropropoxypropyl - 3: 5 - dimethyl - 1: 3: 5- trihydroxycyclotrisiloxane.
机译:1,227,074。含酸性填料的可固化有机硅树脂。DOWCORNING CORP。1969年4月25日[1968年5月27日],编号21176/69。标题C3T。可固化树脂包含(A)含至少0-25 wt%的有机硅聚合物。与Si键合的OH基团,其Si原子通过氧原子或可包含醚键的二价烃或卤代烃基连接,其余的Si价由单价烃或卤代烃,任选地含醚的基团或氰基烷基满足,至少提供每个Si原子0-75个这样的基团(B)作为填充剂,MoS 2,ZnS,BN,WS 2,ZnO或粉末状的Ni,Al,Zn,Cu,青铜或不锈钢或它们的混合物,以及(C )三亚乙基二胺或2-乙基-4-甲基咪唑,(C)占(A)的0‑1-10重量%,(A)占(A)加(B)的3-90重量% )。描述了合适的有机硅聚合物;优选的是具有甲基,乙基,异丙基,乙烯基和/或苯基且至少1w的聚硅氧烷t。 OH的百分比。可以使用其他(示例性的)常规填料,其最多占填料总重量的75%,并且可以使用其他常规的固化催化剂,例如丙烯酸酯。 PbO,PbCO 3,羧酸和羧酸铵;其他树脂,例如也可以存在酚醛,环氧树脂或醇酸树脂或PTFE。在实施例1-7中,将含有单甲基和单苯基硅氧烷单元以及一些苯基甲基和二苯基硅氧烷单元和7%OH的聚硅氧烷与MoS 2和/或ZnS和Ca或硬脂酸锌以及任何一种催化剂(C)一起研磨。有或没有邻苯二甲酸二烯丙酯树脂加过氧化二枯基,或巴西棕榈蜡加双环氧二环戊二烯加环状琥珀-戊二酸二酐或二苯甲酮四羧酸二酐,或酚醛树脂或滑石粉。在实施例9中,描述了使用所有指定的填料(B)和催化剂(C),以及含有甲基,乙基,异丙基,十八烷基,苯基,甲苯基,氰基丙基,甲氧基丙基和三氟丙基的硅氧烷和一些单元的多种组合物- Si(CH 3)C 6 H 4 OC 6 H 4 Si(CH 3)O-和-Si(CH 3)2 CH 2 CH 2 CHFCH 2 CH 2 -Si(CH 3)2-辅助填料:气凝胶SiO 2,TiO 2,石英,硅藻土,Fe 2 O 3,玻璃纤维或Fe 2 O 3;以及有机硅化合物:1:3:5- 3-(羟基二甲基甲硅烷基)-苯,苯基硅烷三醇,HOSi(CH 3)2 OSi(CH 3)2 CH 2 CH 2 CH 2 OCH 2 CHFCH 2 Si(CH 3)2 OSi( CH 3)2 OH或1-三氟丙氧基丙基-3:5-二甲基-1:3:5-三羟基环三硅氧烷。

著录项

  • 公开/公告号DE1925980B2

    专利类型

  • 公开/公告日1971-07-22

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE19691925980

  • 发明设计人

    申请日1969-05-21

  • 分类号C08G47/00;

  • 国家 DE

  • 入库时间 2022-08-23 09:38:13

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