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METHOD FOR DEPOSITING THIN FILMS ON THIN ELONGATED ELECTRICALLY INSULATING SUBSTRATES

机译:在细长的电绝缘基底上沉积薄膜的方法

摘要

A method for depositing thin films on thin elongated, electrically insulating substrates by bias-sputtering material from two targets on to the substrates in an electrical plasma, the substrates being suspended over apertures in an electrically biased metallic substrate holder, around which is formed a dark space filling said apertures and surrounding the substrates. A thin film deposited by said method has good film adhesion, good all-over uniformity and electrical properties close to the bulk valus of the film material so as to be applicable as sensing element in sensors.
机译:一种通过在电等离子体中将材料从两个靶材偏压溅射到基板上而在细长的电绝缘基板上沉积薄膜的方法,基板悬挂在电偏压金属基板支架的孔上方,周围形成深色填充所述孔并围绕基板的空间。通过所述方法沉积的薄膜具有良好的薄膜粘附性,良好的整体均匀性和接近薄膜材料体积值的电性能,从而可用作传感器中的传感元件。

著录项

  • 公开/公告号US3676320A

    专利类型

  • 公开/公告日1972-07-11

    原文格式PDF

  • 申请/专利权人 DISA ELEKTRONIK AS.;

    申请/专利号USD3676320

  • 发明设计人 ORLA CHRISTENSEN;

    申请日1970-03-13

  • 分类号C23C15/00;

  • 国家 US

  • 入库时间 2022-08-23 07:54:11

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