APPARATUS FOR IMPROVING ALIGNMENT OF BEAM LEADED BONDING TOOLS

摘要

An improved bonding tool and method permitting improved accurate relative alignment of a bonding tool, a beam leaded device and a substrate onto which electrical leads from the beam leaded device are to be welded or bonded. Particular use is made of a unique reference area or point provided on the tool itself to aid in the alignment processes and in the preferred embodiment, a mirror surface is utilized to support the beam leaded device during alignment of this device with a reference point on the tool thus further facilitating detection of minor relative misalignments which can then be corrected by an operator.