A process for the preparation of a layer of solder and application of the method to metallic connection - and semiconductor

• 1. 在使用金属网情况下预钎焊镀金属的基片上的金属面的方法;带有具有织网的表面结构的焊料层的镀金属的基片 [P] . 中国专利： CN104853873A . 2015-08-19
• 2. 金属表面高耐磨复合焊层焊料与制备方法以及在金属零部件方面的应用 [P] . 中国专利： CN111618481A . 2020-09-04
• 3. A process for the preparation of a layer of solder and application of the method to metallic connection - and semiconductor [P] . 德国专利： DE1589502C3 . 1974-01-24

  机译： 制备焊料层的方法及其在金属连接和半导体上的应用

• 4. A process for the preparation of a layer of solder and application of the method to metallic connection - and semiconductor [P] . 德国专利： DE000001589502C . 1974-01-24

  机译： 制备焊料层的方法及其在金属连接和半导体上的应用

• 5. Process for applying a solderable conductive layer and production of a solder connection between this conductive layer and a metallic conductor tape [P] . 德国专利： DE3710189A1 . 1988-10-13

  机译： 施加可焊接的导电层的方法以及在该导电层和金属导体带之间产生焊接连接的方法

• 1. Tailoring metallic surface properties induced by laser surface processing for industrial applications [J] . Guoqing Hu, Yang Song, Yingchun Guan 纳米技术与精密工程（英文） . 2019,第001期
• 2. Application of Neon Ion Beam for Processing â…¢-â…¤ Semiconductors and Atom Probe Sample Preparation of Ga sensitive materials [C] . Vignesh Viswanathan, Deying Xia, Hanfang Hao, 応用物ç†å­¦ä¼šå­¦è¡“講演会;応用物ç†å­¦ä¼š . 2020
• 3. Advanced spatial data mining methodology and its applications to semiconductor manufacturing processes. [D] . Kim, Byunghoon. 2015
• 4. Application of Plasma Sprayed Cu Intermediate Layers in the Soldering Process of Graphite Composite to 6060 Aluminum Alloy [O] . Tomasz Wojdat, Paweł Sokołowski, Leszek Łatka, 2020
• 5. New method of specimen preparation for high temperature X-ray diffraction, and its applications to some semiconductor wafers. [O] . Tsutomu KAWAMURA 1992
• 6. Research and Development of New Technologies for the Preparation of III/V Semiconductor Materials and on Methods for Evaluation of the Quality of These Materials - Project: GA(AS,P) Epi Layers and Substrates for Them [R] . Stath, N. 1982

• 1. Applications of Secondary Electron Composition Contrast Imaging Method in Microstructure Studies on Heterojunction Semiconductor Devices and Multilayer Materials [J] . 刘安生 ,邵贝羚 ,安生 . 稀有金属：英文版 . 1999,第2期
• 2. PREPARATIONS OF FERRIMAGNETOFLUIDS AND THEIR APPLICATIONS IN MINERAL PROCESSING [J] . 袁楚雄 ,刘奇 . 武汉理工大学学报：材料科学英文版 . 1994,第1期
• 3. Effect of different processing methods for the hole transporting layer on the performance of double layer organic light-emitting devices [J] . SU0 Fan YUJun-sheng DENG Jing LOUShuang-ling JIANGYa-dong . 光电子快报：英文版 . 2007,第4期
• 4. Tailoring metallic surface properties induced by laser surface processing for industrial applications [J] . Guoqing Hu ,Yang Song ,Yingchun Guan . 纳米技术与精密工程 . 2019,第001期
• 5. PBN在半导体材料制备上的应用 [C] . 何军舫 ,刘同顺 ,陈宏亮 . 第五届全国分子束外延学术会议 . 1999
• 6. 金属衬底上PLD方法制备缓冲层及YBCO超导层 [A] . 刘林飞 . 2010