Copper-plated aluminium wire prodn - with cross-section reduction effected to form diffusion layer between copper and alumini

摘要

The wire is formed in the usual way but is reduced in cross section either by pref. 80% without application of heat or by =50% a pref. 400 degrees C to induce the formation of a diffusion layer between the Cu and the Al. The process is conducted in an inert gas and the Al stored in such an atmosphere prior to working. The process is assisted by roughening the Cu surface which is to adhere to the Al and ensuring the cross section is correct. Better adhesion between the surfaces is obtained and mechanical props. are improved.