Metallised reinforcement on metallised ceramic is formed by applying, e.g. by painting or spraying on, a suspension layer, a few microns thick, of an organometallic cpd., esp. of Ni, Cu, Co or similar metals, from which metal layer is separated by heat-dissociation after applying solder on prodn. of actual solder bond, in process for adhesive, vacuum tight solder bond prodn. between ceramic bodies and pts. of metal or ceramic, by metallising ceramic surface, providing an additional metal deposit as metallic reinforcement, and then soldering, through an inserted, esp. hard solder, with the other opt. similarly pretreated pts., by heating in an inert protective gas atmos. or in vacuo. Process is esp. useful for electric discharge vessel mfr. Pref. cpds. used are bis-(2-4-pentanedionato)-Ni or Ni(II)-oxalate, Cu-Cr acetylacetonate and Co2(CO)5.
展开▼
