首页> 外国专利> method for the continuous change of the electrical properties of at least a part of a halfgeleiderlichaam of germanium or silicon by a ionenbombardement and halfgeleiderlichaam vervaardigd by application of the method.

method for the continuous change of the electrical properties of at least a part of a halfgeleiderlichaam of germanium or silicon by a ionenbombardement and halfgeleiderlichaam vervaardigd by application of the method.

机译:通过离子轰击连续改变锗或硅的至少一部分半锗或硅的电性能的方法,并且通过应用该方法进行了全面的研究。

摘要

1,035,151. Semi-conductor devices. NORTH AMERICAN AVIATION Inc. Jan. 20, 1964 [Jan. 18, 1963; Sept. 9, 1963], No. 2467/64. Heading H1K. A semi-conductor 32 is heated whilst being bombarded with ions 37 of atoms required to be introduced into the semi-conductor as interstitial impurities. The ions are of sodium, potassium, rubidium or caesium and the temperature to which the body is heated is a temperature in the range 300‹ to 700‹ C. such that the damage to the semiconductor crystal lattice, which could otherwise be occasioned by the ionic bombardment, is avoided. Semi-conductors produced, or having their conductivity modified, in this way are stated to absorb the alkali metals as interstitial impurities and to be produceable-depending on the energy and duration of the bombardment, the temperature, the orientation of the semi-conductor crystal &c. -with a variety of characteristics suitable for application to field effect transistors, nuclear particle detectors, non-linear capacitors, and PN junction photo-cells. The detailed description is particularly concerned with the introduction of caesium and sodium into borondoped silicon. The host material may, however, be germanium or an alloy thereof with silicon, and it may be intrinsic or pre-doped with aluminium, gallium, indium, phosphorus, arsenic or antimony. The treatment chamber of Fig. 1 comprises a support 31 for the semi-conductor crystal, a heater 30, a source 22 of the ions and a source 41 of either heated caesium or an inert gas. Before treatment, the chamber is gettered with caesium and/or flushed with the inert gas. During treatment the valve 42 is closed and a vacuum pump connected to outlet 26.
机译:1,035,151。半导体器件。 1964年1月20日[北美航空]。 1963年18日; [1963年9月9日],第2467/64号。标题H1K。半导体32被加热同时被需要作为间隙杂质引入到半导体中的原子的离子37轰击。离子是钠,钾,rub或铯的离子,加热到人体的温度是300℃至700℃范围内的温度,以至于损坏半导体晶格,否则可能会损坏半导体晶格。避免离子轰击。据称以这种方式生产的半导体或经过电导率修改的半导体吸收碱金属作为间隙性杂质,并且可以生产,具体取决于轰击的能量和持续时间,温度,半导体晶体的取向&C。 -具有适用于场效应晶体管,核粒子检测器,非线性电容器和PN结光电电池的多种特性。详细描述特别涉及将铯和钠引入硼沉硼硅中。然而,主体材料可以是锗或其与硅的合金,并且其可以是本征的或预先掺杂有铝,镓,铟,磷,砷或锑。图1的处理室包括用于半导体晶体的支撑件31,加热器30,离子源22和加热的铯或惰性气体的源41。在处理之前,将腔室中的铯吸除和/或用惰性气体冲洗。在处理过程中,阀42关闭,真空泵连接到出口26。

著录项

  • 公开/公告号NL141710B

    专利类型

  • 公开/公告日1974-03-15

    原文格式PDF

  • 申请/专利号NL19630302630

  • 发明设计人

    申请日1963-12-24

  • 分类号H01L7/54;H01L3/14;H01L7/38;

  • 国家 NL

  • 入库时间 2022-08-23 06:09:46

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