Thin film circuit with chromium/carbon bonding layer - between insulating base plate and electrically functional layer, for improved adhesion

摘要

A Cr-C layer contg. 1-20 wt.% C is used as intermediate bonding layer between the insulating base plate and the functional layer, opt. having prefinished electrical elements and conductors for switching and/or contact between the layer and the elements. Improved adhesion is obtd between conductors applied in vacuo and sandwich layers and to (in)org. substrates. The Cr-C layer improves adhesion and is simpler to mfr. than Cr-Ni layers, while the Cr vaporiser boats are more stable, since they are strongly attacked by Ni.