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Sintered glass-ceramic bodies having low dielectric constant - contg. polycrystalline, refractory, ceramic phase and glass phase
Sintered glass-ceramic bodies having low dielectric constant - contg. polycrystalline, refractory, ceramic phase and glass phase
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机译:介电常数低的烧结玻璃陶瓷体-续多晶,耐火材料,陶瓷相和玻璃相
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摘要
Sintered glass-ceramic bodies having a low dielectric constant contain a poly-crystalline, refractory, ceramic phase and a glass phase (borosilicate or alumina-borosilicate) formed between the crystalline aggregates in an amt. of 25-65 wt % (pref. 35-50 wt %) w.r.t. the whole material. The ceramic phase is pref. alumina, spodumene, wollastonite, magnesium silicate and/or kyanite; it can be acidic, basic or neutral. The material is used for electric insulation, esp. for multilayer electronic packages. The dielectric constant is low (the ceramic phase 6-9; the glass phase 5.0; the dielectric constant of the material as a whole is 4.3-6.2) and so is the coefft. of thermal expansion (5 x 10-6 degrees C-1, esp. 3.3-4.5 x 10-6 degrees C-1). The sintering temp. is relatively low (825-929 degrees C); therefore, the material can be metallised with Ag, Cu or an, or their alloys with Pd or Pt. The material has high density (2.15-2.35 g/cm3) and is impermeable to liquids and gases. The bending strength is high (2100-4200 kg/cm2). The dielectric loss is low (0.05, pref. 0.001 at 1 kH2-200 MH2). The thermal conductivity is high.
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机译:具有低介电常数的烧结的玻璃陶瓷体包含多晶的,耐火的陶瓷相和在amt中的结晶聚集体之间形成的玻璃相(硼硅酸盐或氧化铝-硼硅酸盐)。 w.r.t的25-65 wt%(优选35-50 wt%)整个材料。陶瓷相是优选的。氧化铝,锂辉石,硅灰石,硅酸镁和/或蓝晶石;它可以是酸性,碱性或中性的。该材料尤其是用于电绝缘。用于多层电子封装。介电常数很低(陶瓷相为6-9;玻璃相为5.0;整个材料的介电常数为4.3-6.2),系数也是如此。热膨胀系数(5 x 10-6摄氏度,尤其是3.3-4.5 x 10-6摄氏度)。烧结温度相对较低(825-929摄氏度);因此,该材料可以用Ag,Cu或An或与Pd或Pt的合金金属化。该材料具有高密度(2.15-2.35 g / cm3),并且不渗透液体和气体。弯曲强度高(2100-4200 kg / cm2)。介电损耗低(0.05,在1 kH2-200 MH2下优选0.001)。导热系数高。
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