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KANTSUKOOJUSURU PURINTOHAISENKIBAN NO SEIZOHO
KANTSUKOOJUSURU PURINTOHAISENKIBAN NO SEIZOHO
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机译:Kantsuko Ojusu Purin和Haisen Kiban no Seizoho
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摘要
A method for the production of through holes in a laminate comprising an insulating base provided with a thin metal layer on at least one side, said laminate being intended for printed wiring. The method is characterized in that the thin metal layer is provided with a firmly adhering and protective foil or layer of a material being chemically different from the thin metal layer and that so-called burrs in the thin metal layer obtained during a mechanical machining of the holes are removed by dissolution whereupon the protective foil or layer can be removed.
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