KANTSUKOOJUSURU PURINTOHAISENKIBAN NO SEIZOHO

摘要

A method for the production of through holes in a laminate comprising an insulating base provided with a thin metal layer on at least one side, said laminate being intended for printed wiring. The method is characterized in that the thin metal layer is provided with a firmly adhering and protective foil or layer of a material being chemically different from the thin metal layer and that so-called burrs in the thin metal layer obtained during a mechanical machining of the holes are removed by dissolution whereupon the protective foil or layer can be removed.