首页> 外国专利> ELECTROLYTIC PROCESS AND ELECTROLYTIC BATH FOR PRECIPITATION OF TIN/NICKEL/TIN/COBALT OR TIN/NICKEL/COBALT LAYERS

ELECTROLYTIC PROCESS AND ELECTROLYTIC BATH FOR PRECIPITATION OF TIN/NICKEL/TIN/COBALT OR TIN/NICKEL/COBALT LAYERS

机译:沉淀锡/镍/锡/钴或锡/镍/钴层的电解过程和电解槽

摘要

1396540 Electrolytic deposition of Sn/Ni, Sn/Co or Sn/Ni/Co BERGISCHE METALLWARENFABRIK DILLENBERG & CO KG 20 July 1972 [21 Aug 1971] 33997/72 Heading C7B Sn/Ni, Sn/Co or Sn/Ni/Co layers are electrolytically deposited from a bath containing a Sn salt together with a Ni salt and/or a Co salt and also the fluoride or fluoborate salts of one or more amines, the amine(s) being present in a total amount of at least 10 g/l and up to 100 g/l. Many suitable fluoride and fluoborate salts of amines are specified amongst which are the salts of ethylenediamine, diethylene triamine, triethylene tetramine mono-, di- and/or triethanolamine, 2-ethylaminoethanol, N-benyldiethanolamine, bis-(2-ethoxyethyl)-amine, dicyclohexylamine, melamine and tricyanomethylamine. Specified Sn, Ni and Co salts for the bath are the sulphates, sulphonates, chlorides, acetates, citrates and lactates. The bath may contain HCl. The pH may be adjusted to between 3À8 and 5À5 by the amine and/or by ammonia. Electrolytic deposition may be carried out at between 40 and 90 C at a current density between 0À1 and 5 amps/dmSP2/SP using a sheet Ni anode. In the Examples the fluoride or fluoborate salt of the amine is derived from NH4F.HF or NH 4 BF 4 . A workpiece may be Ni plated before depositing the Sn/Ni. Bodies of Fe may be directly plated with the Sn/Ni, Sn/Co or Sn/Ni/Co. Bodies of Fe, steel, Cu, Ni and brass can be coated directly with Sn/Ni but bodies of die cast Sn or Al are Cu coated first. Coating Sn/Ni on to brass cans, Fe camera housings and bottle openers, die cast Sn door handles, Al fruit juice presses, steel electric devices and printed circuits is referred to.
机译:1396540 Sn / Ni,Sn / Co或Sn / Ni / Co的电解沉积1972年7月20日[1971年8月21日] Ber997che Metallwarenfabrik DILLENBERG&CO KG 33997/72标题C7B Sn / Ni,Sn / Co或Sn / Ni / Co层从含有Sn盐,Ni盐和/或Co盐以及一种或多种胺的氟化物或氟硼酸盐的浴中电解沉积得到的一种或多种胺,其总量至少为10 g / l,最高100 g / l。指定了许多合适的胺的氟化物和氟硼酸盐,其中包括乙二胺,二亚乙基三胺,三亚乙基四胺单,二和/或三乙醇胺,2-乙基氨基乙醇,N-苯基二乙醇胺,双-(2-乙氧基乙基)-胺的盐。 ,二环己胺,三聚氰胺和三氰基甲胺。镀液中指定的锡,镍和钴盐是硫酸盐,磺酸盐,氯化物,乙酸盐,柠檬酸盐和乳酸盐。浴液可能包含HCl。可通过胺和/或氨将pH调节至3-8至5-5。使用片状镍阳极,可在40至90℃之间,电流密度为0到1 amps / dm 2 的条件下进行电解沉积。在实施例中,胺的氟化物或氟硼酸盐衍生自NH 4 F.HF或NH 4 BF 4。可以在沉积Sn / Ni之前镀镍工件。 Fe的主体可以直接镀有Sn / Ni,Sn / Co或Sn / Ni / Co。 Fe,钢,Cu,Ni和黄铜的主体可以直接涂Sn / Ni,但压铸Sn或Al的主体首先要涂覆Cu。涉及在黄铜罐,Fe相机外壳和开瓶器,压铸Sn门把手,Al果汁压榨机,钢制电子设备和印刷电路上涂覆Sn / Ni。

著录项

  • 公开/公告号AU470046B2

    专利类型

  • 公开/公告日1976-03-04

    原文格式PDF

  • 申请/专利权人

    申请/专利号AU19720045200

  • 发明设计人

    申请日1972-08-01

  • 分类号C23B5/32;

  • 国家 AU

  • 入库时间 2022-08-23 02:23:40

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