Acid gold cyanide plating solution - for the production of gold and gold alloy coatings

摘要

The acid gold cyanide plating soln. for the prodn. of Au and Au alloy coatings contains at least one of Sb, Ga, ge, Bi and Sn in the form of a soluble cpd. and in an amt. of 0.01-1,000 mg/l, w.r.t. the total metal content. Pref. the soln. contains a soluble Sn cpd. in an amt. of 1 to 2 mg/l. The Sn compd. is pref. Sn (II) sulphate. The Au plating soln. is replenished during working by addns. of Au cyanide, and of the alloying elements or cpds. of these, and a stabiliser. The stabiliser is an aq. soln. contg. =1 Sb, Ga, Ge, Bi and Sn in the form of a soluble cpd. such as an oxide, salt, citrate or tartrate, a complexing organic acid, and a reducing agent such as hypophosphite. Allows working with higher c.d. with a lower expenditure regarding regeneration of the bath, and produces a Au or Au alloy electrodeposit of higher quality.