GOLD PLATING ADDITIVE WHICH COMPRISES CONDUCTIVE POLYMETAL SUCH AS POLYACETYLENE SOLUTION AND IS MIXED IN EQUAL AMOUNT WITH POTASSIUM GOLD CYANIDE TO PERFORM GOLD PLATING AND PREPARATION METHOD OF ADDITIVE COMPOSITION

摘要

PURPOSE: To provide an additive capable of greatly reducing an amount of gold required during gold plating and obtaining the same color and gloss as in pure gold plating, an additive for obtaining the same electrical properties as a pure gold plating layer without conductivity deterioration of gold plating layer to greatly reduce fabrication costs of PCBs or IC semiconductors, and a preparation method of additive composition. CONSTITUTION: A method for preparing a gold plating additive composition comprises a step of slowly agitating and mixing 85 to 93 wt.% of distilled water with a trace of hexavalent sulfur oxide and 7 to 15 wt.% of conductive polymetal such as a polyacetylene solution that is a conductive polymer compound at an ordinary temperature, wherein 100 wt.% of the additive composition is mixed with 100 wt.% of potassium gold cyanide to prepare a gold plating solution. The gold plating additive has a composition comprising 85 to 93 wt.% of distilled water, a trace of hexavalent sulfur oxide, and 7 to 15 wt.% of conductive polymetal such as a polyacetylene solution that is a conductive polymer compound, wherein 100 wt.% of the additive composition is mixed with 100 wt.% of potassium gold cyanide to prepare a gold plating solution.